Scale AI Without Limits: KIOXIA Showcases Breakthrough Flash Storage Solutions at FMS 2025
Company Highlights Industry’s First 245.76 TB SSD and Other Innovations Redefining Storage for AI-Driven Infrastructure
KIOXIA, the inventor of NAND flash memory, will once again take centre stage at FMS: the Future of Memory and Storage to spotlight how its flash memory and SSD innovations are driving scalable, efficient infrastructure for artificial intelligence (AI). With a focus on real-world applications and performance gains, KIOXIA will demonstrate how its latest solutions meet the evolving demands of AI across data center and enterprise environments.
At FMS 2025, KIOXIA will spotlight its newest products, including the high-capacity KIOXIA LC9 Series – the industry’s first[1] 245.76 terabyte (TB)[2] NVMe SSD. Additional highlights include the KIOXIA CM9 Series and KIOXIA CD9P Series SSDs built with the company’s BiCS FLASHTM generation 8 3D flash memory, delivering performance, power efficiency, and versatility. KIOXIA will also display BiCS FLASHTM generation 9 memory, which uses 1 terabit (Tb)[3] 3bit/cell technology and utilises the CBA (CMOS directly Bonded to Array) architecture introduced in generation 8. BiCS FLASHTM generation 9 memory provides improvements in data read speed and power consumption reduction, PI-LLT and SCA.
“Artificial intelligence is reforming data infrastructure, and KIOXIA is advancing storage technology alongside it,” said Axel Störmann, Vice President and Chief Technology Officer for Memory and SSD products at KIOXIA Europe GmbH. “KIOXIA is at the forefront with its scalable, high-performance solutions designed specifically for AI.
Our BiCS FLASH™ technology features a 32-die stack QLC architecture and innovative CBA technology. Delivering an industry-first[1] 8TB per chip package, this breakthrough redefines the performance, scalability, and efficiency needed to power next-generation AI workloads.”
At FMS, KIOXIA will give a keynote presentation and participate in the Executive AI Premier Level Panel covering the following topics:
FMS Keynote Presentation:
“Optimize AI Infrastructure Investments with Flash Memory Technology and Storage Solutions”
Tuesday, August 5 at 11:00 am PDT
Katsuki Matsudera, General Manager of the memory technical marketing managing department for KIOXIA Corporation and Neville Ichhaporia, Senior Vice President and General Manager of the SSD business unit for KIOXIA America, Inc. will present this keynote session.
Executive AI Premier Level Panel:
“Memory and Storage Scaling for AI Inferencing”
Thursday, August 7 at 11:00 am PDT
Rory Bolt, Senior Fellow and Principal Architect, SSD business unit for KIOXIA America Inc., will participate in an executive session, which brings together a panel of experts from inside NVIDIA and across the storage and memory industry. The panel provide insight on how to avoid potential pitfalls and configure, secure, and tune to get the most out of storage and memory for different AI applications.
KIOXIA’s expertise will also be featured in panel discussions and educational tracks throughout the week.
Educational Speaking Sessions by KIOXIA:
Monday, August 4
Professional Development Series Track
1:00-2:45 pm
PDSD1: KIOXIA AiSAQ™ OSS: Scaling RAG Beyond DRAM Limits with SSD
Speaker: Rory Bolt
● Review of KIOXIA AiSAQ
Tuesday, August 5
Automotive Applications Track
8:30-9:35 am
AUTO-101-1: Software Defined Vehicles
Speaker: Kevin Hsu
● How UFS Storage is Evolving for On-Device AI and Autonomous Vehicles
AI and ML Applications Track
9:45-10:50 am
AIML-102-1: Storage for AI: Applications
Speaker: Assaf Sella
● All-in-storage ANNS Algorithms Optimize Performance Within a RAG System
Computational Storage Track
9:45-10:50 am
COMP-102-1: Computational Storage Implementations and Ideas
Speaker: Mahinder Saluja
● Integrate Multiple Offload Fixed Function Storage Services to Storage Subsystem
Wednesday, August 6
SSD Tech Track
8:30-9:35 am
SSDT-201-1: SSD Technologies for AI and the DC
Speaker: Rory Bolt
● High IOPS SSD for AI Applications
Data Security/Ransomware Protection Track
8:30-9:35 am
DSEC-201-1: Data Defense: Advanced Protection Strategies and Compliance
Speaker: Paul Suhler
● Sanitization: Product Requirements and Legal Requirements
Industry Associations Track
8:30-9:35 am
INDA-201-1: NVMeTM State of the Union, Configurable Device Security and QoS
Speaker: Cameron Brett (Chairperson)
● Hosting the session
CXL™ Track
3:20-4:25 pm
CXLT-203-1: CXL Use Cases
Speaker: Mahinder Saluja
● Eliminate Data Bottlenecks with CXL Interface and Low-latency XL-Flash
SSD Technology Track
3:20-4:25 pm
SSDT-203-1: High Cap SSDs and Optimizations for QLC Flash Storage
Speaker: Mike Klemm
● To be confirmed
FDP and ZNS Track
3:20-4:25 pm
FARC-203-1: Flash Architectures and Provisioning
Speaker: Rory Bolt
● FDP Use Cases
Thursday, August 7
DC Storage and Memory Track
8:30-9:35 am
DCTR-301-1: Enterprise Storage and SSD
Speaker: Mahinder Saluja
● Offloading Storage Compute Tasks from DPU to SSD Can Free Compute Resources
NVMe Track
9:45-0:50 am
NVME-302-1: NVMe New Features
Speaker: Cameron Brett (Organizer)
● NVMe protocol innovations and their implications for future architectures
SSD Technology Track
1:25-2:30 pm
SSDT-304-1: Error Correction, Reliability, and Telemetry Techniques for SSDs
Speaker: Devesh Rai
● Data Scrubbing and Rebuild in a High-capacity SSD Environment
QLC and PLC Track
1:25-2:30 pm
QLCP-304-1: Multi-Level Cells Part 2
Speaker: Kevin Hsu
● Enabling Higher Capacity Storage with QLC UFS
Data Security/Ransomware Protection Track
1:25-2:30 pm
DSEC-304-1: Quantum Resilience: The New Storage Security Frontier
Speaker: Paul Suhler
● Get Ready for Post Quantum Cryptography
KIOXIA Booth Demos
Product and technology demonstrations will be given in the iconic 2-level KIOXIA booth #307 – featuring ten separate exhibit locations – on the show floor, including:
● Expanding Use Cases – High-Capacity Package/Low Latency Flash memory: 32-die stack in a small BGA package of BiCS FLASHTM generation 8 QLC 3D flash memory /XL-FLASH with a CXL™ interface
● KIOXIA BiCS FLASHTM generation 9 3D Flash Memory: 1 Tb[3] wafer and a small BGA package with 512Gb chip
● KIOXIA BiCS FLASHTM generation 10 3D Flash Memory: 1 Tb[3] wafer and model display
● KIOXIA UFS – Consumer and Automotive: High-performance solutions for evolving markets
● High Capacity 245.76 TB[2] SSD in Dell PowerEdge™ 7715: Featuring KIOXIA LC9 Series Enterprise NVMe SSDs
● Performance and Power Demo: Featuring KIOXIA CD9P Series Data Center NVMe SSDs
● ML Perf Storage Training: Featuring KIOXIA CM9 Series Enterprise NVMe SSDs
● GPU direct SSD Emulation: Investigating GPU direct storage devices at 143 million IOPS
● KIOXIA AiSAQ™ Software: Enabling flexible balancing of capacity and performance
● RAID Offload and Data Scrubbing: Featuring KIOXIA CM7 Series Enterprise NVMe SSDs
